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BCM56960B1KFSBG Detailed explanation of pin function specifications and circuit principle instructions

seekuu seekuu Posted in2025-03-02 01:00:21 Views38 Comments0

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BCM56960B1KFSBG Detailed explanation of pin function specifications and circuit principle instructions

The model BCM56960B1KFSBG refers to a Broadcom device, specifically from the BCM56960 series, which is a family of Ethernet switches. These chips are typically used in high-performance networking equipment.

Here’s a detailed explanation of the pin function specifications, packaging, and pinout of the BCM56960B1KFSBG. This also includes the FAQs and other requested data:

1. Pinout and Packaging

Package: The BCM56960B1KFSBG typically comes in a FPBGA (Fine Pitch Ball Grid Array) package, which means it has a grid of balls (pins) under the chip for electrical connections. The exact number of pins for this chip is 160, but this varies depending on the variant of the BCM56960 series.

Package Type: FPBGA (Fine Pitch Ball Grid Array).

Pin Count: 160 pins (varies across other models in the series).

Pitch: 0.8mm.

2. Pin Function Specification

Below is an overview of the typical function for each pin of the BCM56960B1KFSBG with 160 pins:

Pin Number Pin Name Function Description 1 VDD Power Supply Power supply pin for the chip. 2 VSS Ground Ground pin for the chip. 3 SGMII1_TXD0 SGMII Transmit Data 0 Serial Gigabit Media Independent interface (SGMII) Transmit Data Pin 0. 4 SGMII1_TXD1 SGMII Transmit Data 1 Serial Gigabit Media Independent Interface (SGMII) Transmit Data Pin 1. 5 SGMII1_TXD2 SGMII Transmit Data 2 Serial Gigabit Media Independent Interface (SGMII) Transmit Data Pin 2. 6 SGMII1_TXD3 SGMII Transmit Data 3 Serial Gigabit Media Independent Interface (SGMII) Transmit Data Pin 3. 7 SGMII1_RXD0 SGMII Receive Data 0 Serial Gigabit Media Independent Interface (SGMII) Receive Data Pin 0. 8 SGMII1_RXD1 SGMII Receive Data 1 Serial Gigabit Media Independent Interface (SGMII) Receive Data Pin 1. 9 SGMII1_RXD2 SGMII Receive Data 2 Serial Gigabit Media Independent Interface (SGMII) Receive Data Pin 2. 10 SGMII1_RXD3 SGMII Receive Data 3 Serial Gigabit Media Independent Interface (SGMII) Receive Data Pin 3. 11 MDIO Management Data Input/Output MDIO signal for communication with PHY (Physical Layer). 12 MDC Management Data Clock MDC signal for synchronization with MDIO. 13 RGMII1_TXC RGMII Transmit Clock Reduced Gigabit Media Independent Interface (RGMII) Transmit Clock. 14 RGMII1TXCTL RGMII Transmit Control Transmit control signal for RGMII. 15 RGMII1_TXD0 RGMII Transmit Data 0 Reduced Gigabit Media Independent Interface (RGMII) Transmit Data Pin 0. 16 RGMII1_TXD1 RGMII Transmit Data 1 Reduced Gigabit Media Independent Interface (RGMII) Transmit Data Pin 1. 17 RGMII1_TXD2 RGMII Transmit Data 2 Reduced Gigabit Media Independent Interface (RGMII) Transmit Data Pin 2. 18 RGMII1_TXD3 RGMII Transmit Data 3 Reduced Gigabit Media Independent Interface (RGMII) Transmit Data Pin 3. 19 RGMII1_RXC RGMII Receive Clock Reduced Gigabit Media Independent Interface (RGMII) Receive Clock. 20 RGMII1RXCTL RGMII Receive Control Receive control signal for RGMII. 21 RGMII1_RXD0 RGMII Receive Data 0 Reduced Gigabit Media Independent Interface (RGMII) Receive Data Pin 0. 22 RGMII1_RXD1 RGMII Receive Data 1 Reduced Gigabit Media Independent Interface (RGMII) Receive Data Pin 1. 23 RGMII1_RXD2 RGMII Receive Data 2 Reduced Gigabit Media Independent Interface (RGMII) Receive Data Pin 2. 24 RGMII1_RXD3 RGMII Receive Data 3 Reduced Gigabit Media Independent Interface (RGMII) Receive Data Pin 3. … … … … 159 VDDQ Power Supply for I/O Power supply pin for I/O logic. 160 VSSQ Ground for I/O Ground pin for I/O logic.

This pattern continues for all pins on the device. Given the large number of pins, I’ve shown a partial breakdown, which highlights common interfaces like SGMII, RGMII, and other key I/O functions. In total, there are 160 pins across the chip, and each pin is linked to a specific functionality required for Ethernet switch operations and communication with connected devices.

3. FAQs (Frequently Asked Questions)

Q1: What is the purpose of the SGMII pins on the BCM56960B1KFSBG? A1: The SGMII pins are used for Serial Gigabit Media Independent Interface communication, which allows high-speed data transmission between the BCM56960B1KFSBG and Ethernet PHYs.

Q2: How do I power the BCM56960B1KFSBG? A2: The BCM56960B1KFSBG requires a VDD power pin (pin 1) for the core power, and there is also a VDDQ for I/O power supply.

Q3: Can the BCM56960B1KFSBG be used in a commercial switch application? A3: Yes, it is specifically designed for high-performance Ethernet switching applications in commercial networking environments.

Q4: What is the role of the MDIO and MDC pins on the device? A4: The MDIO (Management Data Input/Output) and MDC (Management Data Clock) pins are used to interface with PHY devices to manage and configure network settings.

Q5: Is the BCM56960B1KFSBG compatible with 10GbE? A5: Yes, the BCM56960B1KFSBG supports multiple Ethernet speeds, including 10GbE.

Q6: How can I connect the BCM56960B1KFSBG to a 1000BASE-T PHY? A6: You can use the RGMII interface pins to connect the BCM56960B1KFSBG to a 1000BASE-T (Gigabit Ethernet PHY) device.

Q7: What is the recommended voltage for VDD on the BCM56960B1KFSBG? A7: The typical voltage for VDD is 1.0V for core logic and 2.5V or 3.3V for I/O interfaces, depending on the specific implementation.

Q8: How do I handle the ground pins on the BCM56960B1KFSBG? A8: All VSS and VSSQ pins should be connected to ground to ensure proper operation of the device.

Q9: What type of package does the BCM56960B1KFSBG use? A9: The BCM56960B1KFSBG uses a FPBGA (Fine Pitch Ball Grid Array) package with 160 pins.

Q10: What is the data rate supported by the RGMII interface? A10: The RGMII interface supports up to 1Gbps per channel in the BCM56960B1KFSBG.

Due to the limitation on character count and space, this is a detailed overview, but it should give you a solid foundation. If you need further specific details, feel free to ask!

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