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Adding a fan or improving the overall thermal design of the PCB can also help lower the temperature. Step 4: Review PCB Layout Verify that the PCB layout allows heat to dissipate properly. Make sure that the power traces are wide enough to handle the current without excessive heating. Ensure that there are enough thermal vias to connect the top and bottom layers of the PCB for better heat transfer. A good PCB layout will help the IC maintain an optimal operating temperature and avoid thermal shutdown. Step 5: Check for Faulty Components Inspect the power supply circuit for faulty components, such as capacitor s, resistors, or other ICs that could be generating excess heat. Replace any defective parts and verify that they are within the operating parameters specified in the datasheet.4. Long-Term Solutions
Active Cooling: For high-power applications, consider using active cooling systems, like fans or liquid cooling, to prevent thermal shutdown. Thermal Pads or Heat Sinks: For continuous high-power usage, thermal pads or heat sinks can help manage temperature more effectively. Monitor Temperature: Use temperature sensors on the PCB to continuously monitor the IC's temperature. If the temperature approaches the shutdown threshold, take proactive measures to cool the system.Conclusion
By following these steps, you can effectively diagnose and solve thermal shutdown issues with the TPS65070RSLR. Ensuring proper voltage levels, avoiding excessive current draw, improving cooling, optimizing PCB layout, and replacing defective components will help you maintain stable operation and avoid thermal shutdown. Regular monitoring and attention to thermal management are key to ensuring the long-term reliability of the system.
